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ZXMD63C03X
PACKAGE DIMENSIONS
e
c
PAD LAYOUT DETAILS
1.02
0.040
E
E1
R1
4.8
0.189
D
mm
R
L
inches
b
A1
A2
A
0.41
0.016
0.65
0.023
DIM
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
A2
b
c
D
-
0.05
0.75
0.25
0.13
2.90
1.10
0.15
0.95
0.40
0.23
3.10
-
0.002
0.0295
0.010
0.005
0.114
0.0433
0.006
0.0374
0.0157
0.009
0.122
E
4.90 BSC
0.193 BSC
E1
2.90
3.10
0.114
0.122
e
0.65 BSC
0.025 BSC
L
R
R1
0.40
0.07
0.07
0.70
-
-
0.0157
0.0027
0.0027
0.0192
-
-
? Zetex Semiconductors plc 2007
Europe
Zetex GmbH
Kustermannpark
Balanstra?e 59
D-81541 München
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Corporate Headquarters
Zetex Semiconductors plc
Zetex Technology Park
Chadderton, Oldham, OL9 9LL
United Kingdom
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
ISSUE 2 - SEPTEMBER 2007
12
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